Physical character:
Atomic Weight: 118.69 Melting Point: mp: 232 ˇăC Boiling Point: bp: 2260 ˇăC
It is mainly used in the manufacture of compound semiconductor, High purity alloy, superconducting material, Solder and as a dopant of compound semiconductor.
Content below:
|
Purity(%) |
As |
Fe |
Cu |
Pb |
Bi |
Sb |
Cd |
Zn |
Al |
Total |
|
99.99 |
0.0005 |
0.0025 |
0.0005 |
0.0035 |
0.0025 |
0.002 |
0.0003 |
0.0005 |
0.0005 |
0.01 |
|
99.95 |
0.003 |
0.004 |
0.004 |
0.01 |
0.006 |
0.014 |
0.0005 |
0.0008 |
0.0008 |
0.05 |
|
99.90 |
0.008 |
0.0025 |
0.008 |
0.04 |
0.015 |
0.02 |
0.0008 |
0.001 |
0.001 |
0.1 |
